株洲通达合金材料有限公司
硬质合金棒销 , 硬质合金球磨罐 , 硬质合金分散盘 , 硬质合金动静环
Special design of the tool structure
发布时间:2018-03-04

Special design of the tool structure

In terms of tool geometry, the design of dry cutting tools should follow the design principle of "low cutting temperature". The structural design of cutting tools must consider the heat generated during processing as little as possible, that is to say, the structure of cutting tools should be low cutting force and Low friction. The normal tool can not adapt to dry cutting, therefore, dry cutting should optimize the geometric parameters of the tool, re the tool has a larger rake angle, and with the appropriate shape of the cutting edge, such as Iscar's various milling inserts -PDR and -PDR HM slot, the use of zero-Ling small straight edge and dual positive rake design, which reduces the cutting force and enhanced edge strength and heat capacity.

In order to reduce cutting heat, Iscar in the car blade, slot blade and milling cutter rake face set to strengthen the edge, the contact area can form a scaly cutting surface, the contact area between the tool and the chip greatly reduced, the vast majority of heat Was taken away by the chip, the cutting temperature is greatly reduced than the ordinary blade, but also increased the shear angle, the tool life significantly improved. In addition, taking into account the maximum lubricity of the tool surface to prevent the build-up of BUEs, Iscar pioneered the hard nickel ferrite layer and Ti ferrite layer on the tool body, greatly improving the hardness and lubricity of the tool body surface. The chip flute profile of the tool also needs to consider the design principle of "low cutting temperature" to ensure the flow of the low friction chip to reduce the friction between the cutting tool and the chip during machining so that the chip evacuation is convenient and fast and the heat accumulation is reduced. Therefore, The card incorporates a stand-up blade construction in the area of milling and grooving blades to prevent chip evacuation and increase chip evacuation space.


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